Used HAMAI 16B #9252516 for sale

HAMAI 16B
ID: 9252516
Vintage: 2011
Lapper 2011 vintage.
HAMAI 16B Wafer Grinding, Lapping and Polishing Equipment is ideal for precision sub-micron planarization of semiconductor materials such as silicon, gallium arsenide and other compound materials. The system operates on a closed loop unit featuring robotic handling through an air shower and wafer surface inspection with a digital microscope for barcode reading for repeatability. HAMAI 16 B consists of several independent tools that each provide a unique grinding, lapping, or polishing function including: Grinding- The grinding process includes grinding wheel and axial feed of the wafer to achieve a homogeneous polished surface and employ off-axis grinding and plunge grinding to control the shape of the final product. Lapping- The lapping station has complete control of the wafer rotation speed and feed speed. The lapping station is afforded precise pressure applied to the wafer which will depend on the substrate material being processed. Polishing- The polishing wheel uses a closed-loop machine, designed to provide precise control of platen tension and polishing media cleanliness to achieve the highest levels of surface finish. The tool also features a web type process control station, which must be changed depending on the size of the wafer being processed and can collect statistical process data such as grind pressure, grind speed, spin speed, and lap time. The purification of the air used per ISO class 5 standards is embedded in the asset as well as the base station of the robotics, which governs the wafer and tool movement. On-board air shower, dust collectors, vacuum, media and recovery systems, all the tools for the process are reinstalled in the model by the operator and 16B unit can be moved to a different location for processing. Because of its automation capabilities and flexibility in a variety of material processing, 16 B is a cost-effective and reliable grinding, lapping and polishing equipment that is applicable in the semiconductor, MEMs, opto-mechanical and solar cell industries.
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