Used HAMAI 16B #9258316 for sale

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ID: 9258316
Vintage: 2002
Polishing machine With polishing plate (4) Motors (5) Carriers Casting brass plate with carborundum 2002 vintage.
HAMAI 16B is a state-of-the-art wafer grinding, lapping & polishing equipment for the production of highly accurate wafers. It combines precision grinding and lapping technology with advanced CNC machine tool control to create an economical and efficient wafer manufacturing platform. The complete system consists of a grinding and lapping machine, a lapping & polishing machine and a CNC control unit as well as a host of automation components, including a silicon carbide disk carrier, a vision machine, a semiconductor material handling tool, a micropositioner and load lock. The grinding and lapping machine offers a wide range of grinding options to meet the exacting needs of the semiconductor fabrication industry. It specializes in processing silicon, gallium arsenide, sapphire and various other wafer materials. The machine is equipped with a high-precision, linear motor drive, seven motor axes and a fine polishing head, as well as a diamond dresser and a flow meter. It also incorporates a number of automatic features, including an automatic table and an automatic feed asset. This combination of features provides a highly accurate and consistent grinding & lapping process. The lapping & polishing machine operates with the same accuracy and precision that makes the grinding machine great. It is equipped with a rotary table, a diamond polishing pad and a number of automatically adjustable parameters. It also has a manual adjustment feature for custom polishing of specific materials and surface requirements. Finally, the CNC control model offers unsurpassed control capabilities, allowing the machine to process complex shapes with speed and accuracy using a variety of machining strategies. The controller also allows for complete machine automation and integration with existing factory production lines. In summary, HAMAI 16 B is a highly precise and efficient wafer grinding, lapping & polishing equipment designed to meet the specific needs of the semiconductor fabrication industry. It combines high-performance grinding, lapping and polishing technologies with advanced CNC machine tool control to provide a cost effective and reliable solution for large-scale and mass production.
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