Used HAMAI 16B #9258328 for sale

HAMAI 16B is a wafer grinding, lapping, and polishing equipment that provides high-precision, high-speed processing of substrates. The system is designed for use in semiconductor fabrication processing and has a wide range of applications throughout the industry. The unit utilizes a high-precision spindle and high-speed precision servomotors to accurately grind, lap, and polish wafers. The integrated lapping machine uses diamond slurry to evenly and accurately lap the wafers. HAMAI 16 B tool includes a grinding spindle, a grinding carriage, a lapping carriage, and a polishing carriage. The grinding spindle is a high-precision part that is capable of grinding wafers down to a thickness of 20 μm. It is capable of operating at 180,000 RPM and has an adjustable pressure gauge to control grinding pressure. The grinding carriage is a highly precise X-Y motion stage that moves the wafers across the spindle for grinding and lapping cycles. The lapping carriage is a critical part of 16B asset that uses diamond slurry to evenly and accurately lap the wafers. This is performed in a two-step process, with the first step being rough lapping and the second step being fine lapping. The diamond slurry is dispensed at the precise rate set by the user, allowing for uniform lapping of the sample with minimal damage. The polishing carriage is the final step in 16 B wafer grinding, lapping, and polishing model. This is done with dielectric polishing suspension and a polishing pad. The polishing pad is a series of fabric impregnated with abrasive particles that provides a uniform and ultra-smooth finish to the substrate. The suspension supplies a slurry of corrosion inhibitors, which further improves the surface finish of the wafer. HAMAI 16B equipment provides a versatile and consistently high-precision way to grind, lap, and polish wafers for semiconductor fabrication. The system's high-precision spindle and adjustable pressure gauge give it a superior performance, while its precision servomotors offer high-speed processing. The integrated lapping unit and dielectric polishing chemicals both provide a consistent and smooth finish that meets the industry's most stringent standards. With its versatile and efficient design, HAMAI 16 B wafer grinding, lapping and polishing machine is an ideal solution for a wide range of semiconductor fabrication needs.