Used HAMAI 16BF-2M #293635662 for sale
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ID: 293635662
Vintage: 1997
Lapper
Rotation speed: 5-60 RPM
Lapping surface plate
With sizing device
(2) 4-Way motors
1997 vintage.
HAMAI 16BF-2M wafer grinding, lapping and polishing equipment is a fully automated device used for the fabrication of high accuracy displays and advanced microelectronic technology. The device is capable of grinding, lapping and polishing various semiconductor wafers and substrates. Constructed with the highest level of accuracy and reliability, the system provides a powerful and versatile solution for highly advanced production processes. 16BF-2M offers a comprehensive range of wafer grinding and polishing capabilities, and allows for the integration of existing polishing pads with the unit. HAMAI 16BF-2M utilizes a two-axis, high-speed grinding machine which is designed to provide repeatable and consistent wafer grinding, lapping and polishing perfect for complex production applications. The tool is designed to offer optimal speed, uniformity and stability for long-term results. The asset features a powerful PC-controlled controller, which allows for precision grinding, lapping and polishing of surfaces. It also includes software-controlled grinding and polishing cycles, as well as real-time performance feedback. Additionally, the model provides the ability to save and recall up to 16 different data sets from previous grinding and polishing cycles. 16BF-2M utilizes a wide range of station-mounted polishing accessories for optimal grinding, lapping and polishing results. This includes diamond disc, felt disc, and wafer mounting fixtures, as well as diamond cleaning pads. Additionally, an optional wafer holder can be mounted to the polishing table for high-quality uniformity and consistency. HAMAI 16BF-2M grinding, lapping, and polishing equipment is a versatile and reliable device that is perfect for the fabrication of high-quality electronic displays and advanced microelectronic technology. With its wide range of processing capabilities and software-controlled grinding and polishing cycles, the device offers precision and repeatable results perfect for complex and long-term production requirements.
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