Used HAMAI 16BF-2M #9114398 for sale

HAMAI 16BF-2M is a state-of-the-art wafer grinding, lapping and polishing equipment designed to offer high precision, low noise and fast turnaround times. It features a compact and robust spindle drive design which is capable of running automatically in a four-stage wafer fabrication process, allowing optimal processing of even the most challenging applications. 16BF-2M utilizes sophisticated feedback controls to ensure an even finish on all particles and substrates. HAMAI 16BF-2M operates with a spindle speed range of 0-3,000 RPM, enabling high quality wafer fabrication in all levels of thickness. Moreover, with its low noise operation, the system ensures minimal disruption to your work environment. To optimize throughput, 16BF-2M incorporates an automated continuous belt cleaning unit. Powered by a brushless DC motor this machine is able to surpass traditional mechanical and chemical cleaning methods. It's capable of removing microscopic contaminants, including semiconductor residues, leaving behind a polished, precise surface. HAMAI 16BF-2M is also equipped with an adjustable lifting and pressing tool. This allows for precise control of the lapping and grinding pressure, ensuring a uniform and consistent repeatable process every time. 16BF-2M maintains 16mm of down-force, preserving a consistent polishing when wafers thinner than 16mm require special attention. HAMAI 16BF-2M is a highly adjustable asset that ensures superior performance for both large and small wafer fabrication. With its built-in safety features, the model is suitable for operation in any environment. 16BF-2M can be customized with respect to the material index or hardness, making it perfect for a range of materials, from soft silicone to ultra hard thin films. In addition, HAMAI 16BF-2M features a user-friendly interface and advanced diagnostics and alarm systems. This allows for efficient and effective adjustment of the equipment to different applications and substrates. Overall, 16BF-2M is a perfect solution for advanced wafer grinding, lapping and polishing. It offers superior precision and accuracy while providing a low-noise and high-throughput operation for maximum efficiency.