Used HAMAI 16BF-2M #9147109 for sale

HAMAI 16BF-2M wafer grinding, lapping and polishing equipment offers superior accuracy and efficiency for a range of semiconductor applications. With its streamlined design, 16BF-2M system provides the highest quality output with minimal cycle times. Using advanced, proprietary grinding techniques, HAMAI 16BF-2M uses specially designed grindstones with uniquely engineered shapes and press-fit bonding systems to guarantee optimal performance. Its high-torque, ultra-precise grinding motors are finely tuned to achieve the highest precision and repeatability of results. This unit has an integrated CCD viewer so that the operator can precisely monitor all grinding and polishing operations. It also features a fully automated machine for repeatable polishing processes that guarantee consistent results. The optional wafer polishing attachment uses a rotary disc-platen tool to provide maximum uniformity and control over the entire polishing procedure. 16BF-2M's modular design provides for easy integration with other systems, such as toolchecking systems and automatic wafer chucking, to provide seamless data acquisition and process automation. Additionally, the asset's computer software can be extensively customized to suit user-specific requirements, helping to ensure maximum precision and repeatability right from the start. The advanced performance and versatility of HAMAI 16BF-2M wafer grinding, lapping and polishing model make it an optimal choice for a wide range of semiconductor applications. With its high control and precision, unbeatable process capability and extensive versatility, it's the perfect choice for a host of quality control and product development activities.