Used HAMAI 16BF-2M #9382365 for sale

HAMAI 16BF-2M is an advanced wafer grinding, lapping, and polishing equipment used for a variety of different processes related to semiconductor production. This system is designed for use in a wide range of applications, including polishing, etching, and deburring. 16BF-2M features an advanced control unit, capable of handling complex processes with ease. This machine is equipped with advanced grinding and polishing heads, as well as diamond lapping wheels to ensure the best possible results. The load capacity of the machine is 250mm, providing enough space for multiple wafers. Additionally, this tool has a reciprocating platform, capable of higher speeds than similar systems on the market. HAMAI 16BF-2M is multi-functional and can accommodate a wide range of polishing processes, including double-sided lapping and polishing, grinding, and deburring. It features an advanced interface which allows for easy control of all the processes, and optional PLC programming for more complex operations. The machine also has a comprehensive safety asset which includes automatic shutdown in the event of power surges or other unexpected occurrences. 16BF-2M has a number of unique advantages. It is equipped with an advanced digital DC motor, allowing for more precise results. The model is also capable of utilizing both conventional and CMP polishing techniques. Finally, HAMAI 16BF-2M is equipped with a unique equipment for monitoring the wafer surface topography while doing the polishing process, so that any changes can be detected and corrected as needed. In summary, 16BF-2M is an advanced wafer grinding, lapping, and polishing system. This unit is designed for use in many different processes, from polishing and etching to deburring. It is equipped with various safety systems and CMP polishing techniques, as well as a unique topography monitoring machine which helps ensure that processes are accurate and precise.