Used HAMAI 16BF-4M-5P #293676465 for sale

HAMAI 16BF-4M-5P is a computer-controlled wafer grinding, lapping, and polishing equipment designed and manufactured by HAMAI Engineering. With a wet grinding, lapping and polishing bed size of 400 mm x 400 mm, the system is highly efficient in producing high quality, highly polished and flat surfaces on a variety of wafer materials, such as silicon, gallium arsenide, and even hard materials such as alumina and quartz substrates. The lapping process starts with grinding the substrate to a designated surface finish. This is followed by a lapping abrasive which further levels the surfaces. In this case, three stages are used with a lap wheel and three disks to progressively level the surfaces. After lapping is complete, the polishing process begins. This is where 16BF-4M-5P really shines, as it uses a multi-polishing head to deliver precision and uniformity on the polished wafer surfaces. The multi-polishing head is designed with four diamond lapping and polishing head to create a consistent and homogeneous finish across the substrate surfaces. The two slurry circulation nozzles ensure uniform distribution of the slurries on the substrate surfaces. The unit is fully automated with a graphical user interface (GUI) that allows for easy control over the process parameters such as abrasive types, rotation speeds, feed-rates and end-point detection. The software also records wafer-processed data for quality assurance and postmortem analysis. HAMAI 16BF-4M-5P is perfectly suited for a wide range of applications such as grinding and polishing of MEMs, LED, semiconductor, and display wafers. The machine offers precision and repeatability with the guarantee of excellent quality results. Moreover, all components are designed with the highest standards of reliability and accuracy in mind, making 16BF-4M-5P an ideal tool for Wafer Processing.