Used HAMAI 16BF-4M-5P #293676467 for sale

HAMAI 16BF-4M-5P is an effective and efficient wafer grinding, lapping, and polishing equipment. It is designed to provide a cost-effective and reliable solution in high-precision semiconductor manufacturing applications, such as for the semiconductor industry and solar cell production. The system features a 16-inch grinding, lapping, and polishing wheel with a bearing speed of 24,000 RPM. It also features a 4-foot by 5-foot working area, making it ideal for large-scale production. The machine has a magnesium-alloy frame that features air bearings for smooth operation. It also has a dust-free design for clean operation and easy maintenance. The machine is also equipped with an independent cooling unit, which ensures uniform grinding and lapping results. The machine is designed to perform various operations, including grinding, lapping, and polishing. The grinding operation involves using the rotating abrasive wheel to remove material from a substrate. Lapping utilizes abrasive particles suspended in various liquids to refine and polish a substrate. Polishing uses a fine-grit abrasive wheel to finish and polish a substrate. All operations on 16BF-4M-5P are controlled via a PLC tool that is robust and user-friendly. The asset allows for quick and accurate changes to grinding parameters, including pressure, speed, and time. The model also has diagnostic capabilities for real-time monitoring and troubleshooting. The machine is also equipped with a powerful self-cleaning equipment. This system uses the rotation of the grinding wheel to remove dust and debris during the grinding process. This eliminates the need for manual cleaning and reduces downtime. The dust-free design of the machine also helps to reduce contamination during the grinding process. Overall, HAMAI 16BF-4M-5P is an outstanding wafer grinding, lapping, and polishing unit. Its robust design, advanced features, and quality results make it an ideal solution for a range of high-precision semiconductor manufacturing applications.