Used HAMAI 16BF-4M-5P #9195534 for sale

HAMAI 16BF-4M-5P is a sophisticated wafer grinding, lapping and polishing equipment designed for high accuracy and high throughput in the semiconductor and optics industries. This advanced system is capable of producing wafers with tight dimensional tolerances and extremely smooth surfaces, as well as high reactive ion etch (RIE) uniformity and tight corner rounding performance. 16BF-4M-5P consists of a vertical spindle grinding machine that is mounted on a base plate. The spindle is mounted with a suspension arm that allows for fine-tuned speed and pressure adjustments to be made while the grinding and polishing process is underway. The spindle is powered using a variable frequency drive unit with a maximum speed of 20,000 RPM and can be programmed up to 1,000,000 RPM. The machine uses a precision tool holder that holds a variety of abrasive tools to perform different grinding and polishing tasks, including diamond, carbide, and ceramic materials. The grinding table is fed by a continuous-feed unit that moves across the table via a motorized roller machine. HAMAI 16BF-4M-5P has a range of options for different wafer sizes and can process substrates ranging from 100mm - 300mm, with a maximum thickness of 15mm. The lapping and polishing process is carried out in two separate chambers, with the first chamber used for lapping and the second chamber used for polishing. The total capacity of the machine is up to 5 plates of wafers at one time. Additionally, the machine is equipped with a water cooling tool and active vibration control to ensure optimal temperature and vibration levels during the grinding and polishing process. 16BF-4M-5P is designed for high throughput production with no need for continuous manual control. Instead, the asset can be set to run unattended for up to 24 hours. Additionally, an automated data logging model allows operators to monitor grinding, lapping and polishing results in real time, making it possible to quickly identify process trends, assess efficiency and manpower requirements, and quickly troubleshoot any issues that may arise. HAMAI 16BF-4M-5P is an advanced wafer grinding, lapping and polishing equipment designed to meet the needs of the semiconductor and optic industries. It is capable of producing wafers with smooth surfaces and tight dimensional tolerances with excellent corner rounding performance, while its automated data logging system ensures high throughput and reduced labor costs.