Used HAMAI 16BF-4M-5P #9407669 for sale

HAMAI 16BF-4M-5P wafer grinding, lapping & polishing equipment is designed specifically for ultra-precise surface processing on semiconductor wafers, substrates and materials such as glass and ceramics. This grinding and polishing system utilizes a two-stage process, in which the sample is pre-treated prior to being ground or polished. This ensures the quality of the end product and helps minimize the possibility of defects in the wafer. 16BF-4M-5P utilizes a diamond grinding wheel and a silicon carbide lapping wheel to perform grinding and lapping, respectively. The unit also includes a 5-stage polishing process to provide additional surface processing. In the grinding process, the sample is secured to the rotating grinding wheel and a controlled amount of grinding material is applied to the surface of the sample. This causes material removal from the sample as the grinding wheel rotates. The lapping process works similarly to the grinding process, except it involves a silicon carbide wafer and more material to be removed from the sample at a time. The 5-stage polishing process includes an initial rough polishing, a mid-level polish, an ultra-fine polish, a diamond pitch polish, and a 3-phase polishing. Each step results in a finer and smoother surface finish of the sample. In addition to the grinding and polishing process, HAMAI 16BF-4M-5P also offers in-situ measurement capabilities. This feature allows for the measurement of surface flatness, scratches and waviness. This would ensure that the sample is of the highest quality before being released to the customer. Additionally, the machine is equipped with a particle-removal tool to ensure that no particles are transferred between samples during processing. Overall, 16BF-4M-5P wafer grinding, lapping & polishing asset is a versatile and highly precise tool for both grinding and polishing of a variety of materials. It offers consistent and reliable results, thanks to its two-stage process and in-situ measurement capabilities. Its ability to measure and produce the highest level of surface processing make it an ideal model for semiconductor wafer manufacturers and other industries in need of precision-processed surfaces.