Used HAMAI 16BF-4M #293668860 for sale

HAMAI 16BF-4M is a four-head wafer grinding, lapping, and polishing equipment which offers multiple features for achieving high-quality surface finishes on wafers. It is equipped with four semi-automatic grinding, lapping, and polishing heads which are used independently or in combination, allowing for the precise and accurate processing of various types of materials. The system is composed of a main body with four heads, a feeder, and a conveyer belt. The machine is driven by an external motor to spin the wafers at speeds of up to 4000 rpm. The rotational speed and accuracy can be adjusted using the four settings on the machine's control panel. The main body of the unit features four primary components: a headstock, a grinding plate, a lapping arm, and a polishing arm. The headstock houses the spindle motor that drives the wafer grinding and lapping process. The grinding plate is equipped with a 0.02" diamond wheel, which is used for grinding and lapping. The lapping arm can be used to control the flow of abrasive material to the grinding plate, and the polishing arm works with diamond films which can be used for polishing. The various heads and arms can be used to adjust the feed and pressure of the wafer grinding, lapping, and polishing process. For example, the feed and pressure can be adjusted using the headstock, as well as the lapping and polishing arms. The heads can also be adjusted to adjust the roughness and smoothness of the finish. The feeder places wafers onto the conveyor belt, allowing them to be moved from one heads to the other. 16BF-4M is equipped with sensors and monitors to ensure that the process is complete and consistent. The machine has a fault detection mechanism which can detect any faults or errors, allowing users to quickly detect and address issues before they become a major problem. All of these features make HAMAI 16BF-4M an ideal tool for producing high-quality, consistent wafers with a smooth finish.