Used HAMAI 16BF-4M #9146433 for sale

HAMAI 16BF-4M Wafer Grinding, Lapping and Polishing Equipment is designed for fine processing of hard material substrates used in a variety of semiconductor, optical, and optoelectronics applications. This flexible, high precision system provides superior results in various grinding, lapping, and polishing applications. 16BF-4M is equipped with a 16 inch blade and a 4 model lapping and polishing plate. The unit allows for both auto and manual plate control. This four control mode machine allows for a high precision, accurate, and flexible grinding and polishing process. It is capable of grinding substrates up to one millimeter thick in a single cycle. The wafer grinding, lapping and polishing tool is equipped with a unique grinder-feed mechanism that allows for continuous operation without requiring manual intervention. This mechanism can also be opted for a single or multiple feed modes. It is also equipped with a precision pressure regulator to allow users to adjust the processing parameters to meet their specific requirements. The machine's grinding and lapping plates are uses diamond or carbide lapping compound to ensure optimum polishing results. The plate is designed to perform all three steps in a single pass, which results in improved yield and lower cost of ownership. The asset has a built in touch screen display that allows the user to make adjustments to the desired parameters on the fly. The model has a timer for automatic shut off and a safety interlock that shuts down the machine in the event of an emergency. In summary, HAMAI 16BF-4M is an advanced wafer grinding, lapping and polishing machine with features like precise cutoff, high precision pressure regulation, and unique grinder feed mechanism. Its versatility and flexibility allows it to process a variety of hard material substrates with precision, accuracy, and cost-effectiveness.