Used HAMAI 16BF-4M #9257668 for sale

HAMAI 16BF-4M (H-16) is a wafer grinding, lapping & polishing machinery equipment specifically designed for the efficient production of optoelectronics, semiconductor, and other microdevice components. The system consists of four different stages in a single integrated platform, designed to provide fast and efficient processing. The first stage is the grinding process, which uses diamond grinding wheels to precisely and accurately remove a minimal amount of materials from wafer edges and surfaces. The second stage is the lapping process, where the wafers are exposed to a combination of a synthetic slurry and diamond pellets, which act in conjunction with polishing cloths to remove the finer impurities not managed in the grinding stage. The third stage is the polishing stage, where a felt-based polishing mat is used to achieve a superior surface finish. The fourth stage is the cleaning stage, which utilizes compressed air to remove dust, debris, and polishing residues. The unit is also equipped with an ARM-BASED CPU Controller, with a open-source Linux operating machine, allowing for real-time data recording and full automation of the process. The advanced wafer handling tool offers highly accurate wafer alignment for increased quality and an efficient wafer-to-wafer cycle time of less than 15 seconds. Additionally, the H-16 is equipped with a user-friendly, touchscreen Human Machine Interface which allows users to monitor the process easily and quickly. The H-16 is also provided with several peripheral units. A 1300mm x 400 mm double-rail X-Y table allows for multi-step positioning and wafer handling. A 4KW dust collecting asset helps to maintain clean work environments, and minimizes the risk of dust from the process becoming airborne. An auto-mist lapping fluid dispenser, alongside the wafer-level treatment chamber for slurry mixing and storage, is provided with the model with a capacity of 3L. The equipment is designed for easy installation, maintenance and upgrades, making it a perfect choice for the production line, with minimal downtime for servicing and cleaning. This wafer grinding, lapping & polishing system is an efficient solution for the production of micro device components, and can be used as an stand-alone unit or as part of an integrated production line.