Used HAMAI 16BF-4M #9273856 for sale

HAMAI 16BF-4M Wafer Grinding, Lapping & Polishing Equipment is a single-spindle system designed for the production of the highest quality polished wafers. It is perfect for high precision grinding and polishing of all types of semiconductor materials. This systemfeatures a high-speed spindle, which produces a fast and smooth grinding/polishing surface. It also features a 45 degree automatic positioning unit and an ergonomic operator station. The machine can be fully automated and provides a high degree of variability and accuracy. 16BF-4M tool utilizes a grinding wheel, which has been designed to enhance the polishing process. The grinding wheel is designed to be very efficient and is capable of performing lapping and polishing work with a high degree of accuracy. The wheel is coated with diamond particles to provide a smooth polishing surface that can be used for both single-side and double-side application. The wheel also includes a variable speed asset that enables the operator to adjust the speed of the wheel based on the application needs. For lapping applications, the model utilizes a specially designed lapping plate which is used to apply the lapping compound to the wafer surface. The lapping plate is designed to be very durable and resistant to wear and tear. It also has a precision setting mechanism which ensures that the correct amount of lapping compound is applied to the wafer surface. The equipment also includes a vacuum system that is used to extract the lapping compound from the wafer surface. For polishing applications, HAMAI 16BF-4M unit includes a special polishing plate that is designed to provide a high degree of accuracy and a smooth finish. The plate is made of special material which is resistant to abrasion and is coated with diamond particles to enable smooth polishing at higher speeds. The plate can also be adjusted for speed and pressure to optimize the process for different materials. Finally, 16BF-4M machine is also equipped with an ergonomic operator station which allows the operator to easily control and adjust the speed and pressure of the tool. The asset also provides an open platform that allows for easy maintenance and support. The model is designed to provide reliable and efficient performance and is capable of producing high-quality polished wafers at a high rate of production. With its advanced design and efficient operation, HAMAI 16BF-4M Wafer Grinding, Lapping and Polishing Equipment is the leading choice for achieving precise, high quality results.