Used HAMAI 16BF-4M #9392792 for sale

HAMAI 16BF-4M is a "wafer grinding, lapping & polishing" equipment from HAMAI, a leading manufacturer of semiconductor polishing equipment. It is an advanced wafer grinding and lapping machine that offers an innovative design and rugged construction, and comes in a space-saving single-ended package. The main components of 16BF-4M Wafer Grinding, Lapping & Polishing System are: a 4-position Drive Unit with stepper motor; a 16-position Loading Arm with an adjustable rpm; a single-wafer processing tool; an 8-position Transfer Arm with a stepper motor; and a Table-level Control Panel with a real-time display. The unit is capable of grinding, lapping, and polishing both single and double-sided wafers up to 8" in diameter. It uses a special abrasive-coated diamond disc to grind the wafer down to the desired shape and thickness, followed by a lapping process to smooth the surface and ensure a homogeneous finish. The machine also features a three-stage polishing process to reduce surface roughness and defects. HAMAI 16BF-4M includes user-friendly features, such as an ergonomic user interface, a non-contact wafer loading mechanism, automatic wafer orientation, and a process status monitoring tool. The advanced control asset allows for precise wafer alignment and the ability to set optimal processing parameters. The model's single-ended design employs a single unit to process the entire wafer, reducing setup costs and ensuring reliability. The rigid construction ensures high accuracy and long-term stability. An integrated dust extraction equipment further reduces contamination, and a directly driven motor eliminates mechanical back-lash. 16BF-4M is designed for durability and high-precision, offering an efficient and reliable tool for wafer grinding, lapping, and polishing operations. It is ideal for a wide range of applications, including semiconductor metrology, lithography, wafer cleaning, display glass polishing, and sub-micron polishing.