Used HAMAI 16BF-5P-4M #9143455 for sale

HAMAI 16BF-5P-4M is an advanced wafer grinding, lapping and polishing machine equipment designed to produce higher quality, more precise components for semiconductor manufacturing applications. The versatile system provides superior performance through a combination of robust design, robotics and precision machinery. The unit is composed of several components, which include a grinding station, lapping station, polishing station, automation conveyor, and inspection machine. The grinding station employs an advanced abrasive wheel grinding tool and motor-driven linear motion feed-thru to guarantee efficient and precise processing. The lapping station utilizes the latest diamond compound and high-speed precision operation, with optional cooling control and high-frequency motors. The polishing station is a hi- frequency vibrator coil, allowing for quality surface finish and consistent topography. The asset also features a fully-automated conveyor model to ensure product movement efficiency from the grinding station to the lapping and polishing station. It can also be configured for multiple processes and materials. This makes sure that no downtime and scrap is incurred due to single-process set up and changeover. 16BF-5P-4M also boasts a precise measurement and inspection equipment to facilitate quality control during and after processing. This includes an in-line video system to pinpoint problem areas, a laser unit to monitor surface cracks, scratches, particles, and a particle imaging machine to detect particles in the production process. All of these features allow for better control over product quality. Overall, HAMAI 16BF-5P-4M is a highly reliable, versatile, and efficient wafer grinding, lapping and polishing tool that produces consistent high-quality products. Its robust design, automation, and precision machinery along with its quality control systems combine to guarantee optimal results. It's the perfect asset for semiconductor applications.