Used HAMAI 16BF-5P-4M #9208866 for sale

HAMAI 16BF-5P-4M is a state-of-the-art wafer grinding, lapping, and polishing equipment designed to achieve high quality surface finishes on all types of wafer materials. This ultra-flexible system offers a full range of solutions for wafer sizes from 25 mm to 450 mm in diameter and features a wide variety of lapping configurations, including double-sided grinding, polishing, and profile lapping. The unit provides advanced automated controls for both machine and feed parameters and allows users to choose from a variety of recipe-based process menus. 16BF-5P-4M uses a multi-step grinding process that helps to ensure increased accuracy and uniformity. The recirculated process water tool is used to create a continuous and uniform grinding environment and to minimize contamination. Additionally, double-sided grinding enables users to grind both sides of a wafer for a superior finish. The polishing station provides custom recipes and high level planarization which allows for a uniform and low-noise grinding process with high yields. This asset is capable of grinding up to 25 wafers per cycle, resulting in higher throughputs and improved efficiency. HAMAI 16BF-5P-4M is equipped with advanced technology for increased safety, accuracy and efficiency. It features a high performance lapping spindle with adjustable parameters and a wide range of process speeds to choose from. The built-in vibration monitoring model provides real-time feedback on the abrasive process while a camera equipment is used for constant visual inspection of the wafer to ensure high quality results. This system is also equipped with easy-to-read LED display for easy and intuitive control and operation. 16BF-5P-4M provides an efficient and reliable solution for a multitude of specialized wafer grinding, lapping, and polishing applications. With its advanced automation, powerful grinding capabilities, and advanced safety features, HAMAI 16BF-5P-4M is the perfect choice for achieving precise wafer surfaces.