Used HAMAI 16BF #293733718 for sale

HAMAI 16BF is a wafer grinding, lapping and polishing equipment designed for production applications. This system can process a variety of materials, including silicon and quartz wafers up to 150mm in diameter with exceptional accuracy and flexibility. 16BF is equipped with an array of controls and features, including automated loading and unloading, variable-frequency grinding and lapping spindles, and a flexible control unit. The multi-functional HAMAI 16BF features a four-axis XY-Z movement unit for maximum versatility in grinding, lapping, and polishing operations. This machine can additionally be equipped with an ergonomically designed workstation, designed to provide an even more comfortable and efficient workspace. The flexible XY-Z control tool allows for precise grinding, setting of speed, and the choice of Standard, Auto-Lock, and Power-On modes. 16BF utilizes the latest grinding and lapping technologies, including diamond abrasive wheels, cubic boron nitride wheels, and electro-chemical polishing systems. These systems are designed to be exceptionally reliable and provide superior surface finish quality with low levels of micro-turbulence even on large production runs. This asset is also equipped with a temperature control model, air flow control equipment, and vacuum filtration system, enabling more consistent and precise results. The overall flexibility and performance of HAMAI 16BF unit make it an ideal choice for production applications, offering automated and manual capabilities for precision grinding, lapping, and polishing operations. Its advanced features and sophisticated control systems give operators the ability to adjust and maintain a consistent level of performance and quality for a wide variety of production applications. From high-precision medical and manufacturing to semiconductor, solar cell, and optical device fabrication, 16BF can deliver top-level grinding, lapping, and polishing results quickly and precisely.