Used HAMAI 16BF #9031438 for sale

HAMAI 16BF is a multifunctional wafer grinding, lapping, and polishing system. It is designed to handle a wide variety of light, medium, or heavy precision workpieces and can be used in combination with smaller-format models to produce greater levels of accuracy and repeatability. The machine is equipped with a base frame with two grinding spindles, two lapping spindles with a range of speeds and a polishing spindle. All of the spindles are independently adjustable. The two grinding spindles can be separately adjusted in multiple axes. The two lapping spindles each feature variable speed, enabling users to adjust speeds to suit material and application requirements. The polishing spindle can be adjusted for RPM and oscillation to achieve a consistent finish. To ensure accuracy and repeatability, 16BF is fitted with precision air and digital positioning systems. The air positioning layer is fine-tuned to produce accurate repeatability and maintain the stability of the machine and its processes. The digital positioning layer controls the workpiece's position and profile for grinding, lapping and polishing operations. HAMAI 16BF is also equipped with a powerful pressurization system, which helps to keep the particles in suspension during the lapping and polishing process, creating extremely smooth and uniform surfaces. The integrated dust collection system ensures an effective working environment, while the powerful vacuum transports the used abrasive or polishing media away from the machine. 16BF is made of corrosion-resistant material, enabling it to withstand long-term and high-intensity work. It comes with a versatile touchscreen interface, which allows users to easily and quickly program their specified processes and parameters. The machine is also compatible with a range of abrasive and polishing media, making it suitable for a wide variety of materials.