Used HAMAI 16BF #9250065 for sale

HAMAI 16BF Wafer Grinding, Lapping & Polishing equipment is an automated, high-precision, and cost-effective hybrid system designed for advanced semiconductor processing. This technologically advanced unit can be used to accurately polish and grind silicone wafers into precise shapes and sizes for various applications. 16BF is ideal for producing high-error-free surfaces and is capable of generating a planar surface finish of better than 0.13µm. The machine consists of three components. The main unit is the grinding/lapping/polishing stage. This consists of two separate motorized spindles that drive the grinding/lapping diamond discs. The second unit is the wafer holder. This contains a removable, high-precision chuck, capable of accurately centering a single wafer or a stack of wafers. The third and final component of HAMAI 16BF are the electronic controls that allow the user to adjust the process parameters and monitor the entire process. 16BF utilizes advanced sensing technology to detect and measure the surface topography of the wafer during the machining process. The electronically controlled spindles also allow for automated RPM adjustment to enable high level accuracy and uniformity in the surface finish. The grinding/lapping process also includes the application of vacuum to the wafer during the machine cycle. This allows for a very short processing time with the highest possible accuracy and repeatability. HAMAI 16BF is a leader in the industry for providing high-precision polishing and grinding of wafers. The tool is automated, flexible and equipped with advanced control systems that ensure repeatability and high-level accuracy. Its advanced, high-precision machining combines grinding, lapping and polishing capabilities to enable high performance surface finishing on various materials. The precise surface finish obtained by 16BF can meet the most demanding semiconductor processing requirements and is an ideal solution for cost-sensitive applications.