Used HAMAI 16BF #9252619 for sale

HAMAI 16BF is a high-end wafer grinding, lapping and polishing equipment. It offers superior process precision and outstanding accuracy. 16BF is designed to facilitate the production of thin and flat wafers, with a thickness range of less than 4 microns. It is capable of grinding wafers in 12 to 20 inch (300 to 500 mm) wafer sizes. The system also features a patented "Grinder Flap" unit, which provides a true, uniform grinding surface. The machine includes a conventional 12" grinder/polisher, and a dedicated lapping/polishing module. The lapping/polishing module features a high power spindle, allowing it to grind wafers to extremely flat surfaces, with an accuracy of up to 1.2 nanometers. HAMAI 16BF is equipped with a series of advanced controls, such as a high precision servo mechanism, an ultra-precision measuring machine, and a touch-screen based interactive panel. This ensures that the process produces a uniform and precise finish. The tool's two modules can be operated simultaneously, improving throughput rates. The operator can also customize the process timing for each module, allowing for optimized cycle times. 16BF has a very small footprint, making it extremely space-efficient. It is also suitable for industrial and laboratory environments, thanks to its sturdy construction and clean design. HAMAI 16BF wafer grinding, lapping and polishing asset is a high-performance machine ideal for the production of defect-free and ultra-flat wafers. Its advanced features and user-friendly controls make it an ideal choice for the production of thin and flat wafers.