Used HAMAI 18B-5L #9276653 for sale

HAMAI 18B-5L is a technologically advanced wafer grinding, lapping and polishing equipment designed to create flat, defect-free surfaces on wafers, dice, dies, and other parts used in the semiconductor industry. This system is configured with an 18-inch wheel plate, which can be used to grind, lap, and polish wafers and other components to produce highly finished surfaces. The grinding wheel has a powerful frequency-controlled motor to provide excellent surface grinding and grinding of delicate surfaces with high precision. The lapping and polishing capabilities of 18B-5L are superior to that of conventional grinding systems, which utilize diamond abrasives or emery pads for lowering the surface roughness and also for improving the qualities of wafer edges and surfaces. The unit's powerful and variable speed motors allow users to adjust the speed to adjust to different sizes and shapes of work pieces. The machine comes with a variable speed inverter-mounted drive, which allows for fully programmable grinding speed from 0 to 500 RPM, suitable for any kind of task. This also provides an optimal speed during the grinding, lapping, and polishing of wafers and other components. Besides its excellent speed control, the tool also comes with a programmable timer, which can be used to set the duration of the grinding and lapping/polishing operation. This allows users to set and resume their processes quickly and easily, saving time while maintaining perfect processing. HAMAI 18B-5L is designed with a powerful dust collection asset, which includes a central dust suction and exhaust device, two suction nozzles with adjustable angle, and an exhaust hood. This model removes all the dust and other debris generated during grinding and lapping/polishing, providing a safe environment for users. This user-friendly equipment is also designed with a user-friendly interface to provide easy operation and quick adjustment. It has an intuitive LCD display that provides clear instructions and detailed graphics to allow smooth handling by the operators even with minimal training. 18B-5L's integrated grinding, lapping, and polishing operation are highly efficient tools for creating smooth surfaces on wafers and other components. This system is perfect choice for high precision wafer grinding, lapping, and polishing.