Used HAMAI 20BN-P #9273140 for sale

HAMAI 20BN-P is a high-end wafer grinding, lapping, and polishing system designed specifically for semiconductor wafers. The machine uses a specialized grinding process to create ultra-smooth surfaces with precise thicknesses and low-defect counts. HAMAI 20 BN P utilizes an array of tools and processes to achieve the desired results. The grinding process begins with a robot that loads the wafer into the grind chamber. A camera located within the chamber captures images of the wafer before grinding begins. These images are used to calibrate the robot's position, ensuring that the wafer maintains its original shape. The next step in the process is to introduce abrasive slurry into the chamber. This slurry is composed of a mineral-based compound suspended in a liquid and is used to finely grind the surface of the wafer. The abrasive slurry is passed through the chamber, grinding the wafer in the process. The next step of the process is to introduce diamond polishing pads into the chamber. The diamond pads are attached to an oscillating arm and are used to polish the wafer to its desired finish. The oscillating arm moves rapidly over the wafer surface, removing any excess material and leaving behind a smooth, uniform finish. Once the wafer is polished, it is then ready to be lapped. During the lapping process, the wafer is held in place with a special clamp and abrasive slurry is added to the surface of the wafer. The abrasive slurry is then moved across the wafer, removing any residual material and creating a flat and smooth surface. Finally, after the wafer is lapped, it is ready for a final polishing process. This process is similar to the initial diamond polishing step, but is done with a finer grade of diamond. This final polishing process is designed to create a mirror-like finish on the wafer, perfect for applications that require precise surface finishes. 20BN-P is a state-of-the-art wafer grinding, lapping, and polishing system that enables companies to produce high-quality wafers at a low cost. The machine is capable of achieving precise finishes, as well as low-defect counts, all while maintaining consistent tolerances and consistent grinding results. This system provides a great solution for businesses looking to reduce expenses and increase product quality.