Used HAMAI 20BN-P #9355608 for sale

HAMAI 20BN-P wafer grinding, lapping & polishing equipment is a state-of-the-art wafer fabrication tool designed to provide high accuracy, high-efficiency, and a reduced cost of ownership. This system specializes in grinding, lapping, and polishing compound semiconductor wafers up to 6-inch variable diameter. The unit includes an innovative wafer retaining plate design that enables the grinding andpolishing of multiple wafer sizes simultaneously. It also features an integrated CCD camera to facilitate precise and automated wafer mapping. The HORIZONTAL Machine Arm (HMA) has also been designed accurately with an 'X-Y-θ' movement range even during high wafer loading conditions. HAMAI 20 BN P is also equipped with an intelligent Wafer Shaping Machine (WSS) and advanced laser tracing sensor to ensure accurate wafer inspection, and to provide the ability to trace accurate processing status. This tool also features an advanced polishing technique that utilizes unique air-bearing spindles to reduce wafer ripple and wear anisotropy. To ensure a unified process for compound semiconductor wafers requires superior control of wafer chuck temperatures, wafer load forces, and spindle performance. This asset features integrated wafer chuck heating and cooling capabilities, as well as advanced spindle control to ensure perfect wafer grinding and polishing consistency for different types of wafer materials and structures. 20BN-P also includes an automated model for the in-situ cleaning and re-processing of wafers during grinding & polishing. This feature ensures that the wafer is ready to meet the demanding fabrication requirements. Furthermore, the equipment also features several safety features like wafer clamping protection and momentary power loss protection. This provides greater protection to wafers from any accidental damage and ensures process consistency. Overall, 20 BN P is a reliable semiconductor wafer fabrication tool with a focus on high accuracy and efficiency. It is designed to provide impeccable accuracy and uniformity during compound semiconductor wafer grinding and polishing processes. It offers a wide range of features such as integrated wafer chuck heating and cooling capabilities, advanced spindle control technology, and automated wafer cleaning and re-processing. All of these features make HAMAI 20BN-P an ideal system for precision wafer fabrication.