Used HAMAI 20BN-P #9355609 for sale

HAMAI 20BN-P is a fully automated, professional wafer grinding, lapping and polishing equipment designed to provide efficient and cost-effective production of wafers and thin films with exceptional surface finish quality. The system utilizes a combination of grinding and lapping with advanced polishing to achieve precision surface finishes on semiconductor, MEMS, electronic, opto, and photo/detector wafers. The unit has a modular design that allows for flexible application - its semi-conductor friendly design is optimized to process up to 20 wafers in one run. HAMAI 20 BN P is equipped with a precision-controlled spindle control machine and an integrated process monitoring tool, ensuring that the asset works as efficiently as possible. The model has the capability to run either single or double-sided grinding, lapping, and polishing processes. 20BN-P offers an easy-to-use, intuitive operator interface that allows for easy parameter and process control. Its advanced software monitors wafer position, feed rate, force, and other important parameters, allowing for quick real-time adjustments as needed. The equipment can process wafers up to 200mm in diameter and up to 4.25mm in thickness, and can handle wafer edge thickness from 0.05mm to 0.125mm. 20 BN P features integrated safety systems, including foot-pedal operation control and programmable emergency stop logic. It is compliant with some of the latest recognized safety standards, including JEDEC/JIS, NEBS, and Telcordia. In addition, it is also engineered to meet strict cleanroom requirements, ensuring a safe and healthy working environment for its operators. Aside from its various safety features, HAMAI 20BN-P is also very energy-efficient, reducing energy consumption and operation costs. It utilizes a unique water-jet system to reduce the amount of water required for wafer grinding and polishing. This unit also ensures that no organic or inorganic contamination of the surface finish is present when the wafers are processed. Overall, HAMAI 20 BN P is a truly comprehensive and user-friendly wafer grinding, lapping, and polishing machine. Its various features and automated functions make it an attractive choice for the production of wafers and thin films with very precise surface finish requirements.