Used HAMAI 22B #9249272 for sale

HAMAI 22B is a wafer grinding, lapping and polishing equipment designed to provide highly accurate finishes on wafers for production and laboratory applications. The system is designed with a modular approach to expand and configure the unit to specific requirements. With precise and accurate control over wafer position, feed rates, and grinding pressures, it can produce extremely consistent finishes with low levels of surface defects. At its core, 22B is equipped with a pair of high-precision grinding heads that offer precise and repeatable control over grinding and polishing operations. Each of the two grinding heads is fitted with a series of interchangeable diamond or polymer grinding and polishing attachments that enable the machine to be adapted for use with a variety of wafer sizes, shapes, and materials. The tool also comes with a small vacuum platen , which enables dust collection and optimal safety during operations. The asset is additionally equipped with a fully embedded control model which allows the user to precisely set grinding conditions, such as operating speed, feed rate and pressure. The embedded equipment enables the user to adjust parameters remotely, using a computer or other digital device, and to monitor the grinding process as it proceeds. This helps ensure optimal repeatability of the grinding operation. The system also includes a pair of lapping and polishing discs with built-in sensors. The sensors measure the pressure applied to the disc and can adjust their polishing force accordingly. The sophisticated sensors also detect when the wafer surface is polished, allowing the unit to automatically adjust the parameters of the grinding cycles. HAMAI 22B is also equipped with a built-in microscope, allowing the user to closely inspect the wafer surface before, during, and after the grinding and polishing processes, in order to achieve optimal polish quality. The microscope also allows for wafer ID recognition, based on integrated machine parameters. Overall, 22B offers highly accurate and repeatable control over grinding and polishing operations, ensuring the highest quality surface finishes for wafers. It is an ideal solution for production and laboratory applications.