Used HAMAI 22BFS-4M #9273134 for sale

HAMAI 22BFS-4M is a state-of-the-art wafer grinding, lapping and polishing equipment. It is designed to provide superior grain size consistency and smoother wafer surfaces in the sub-micron range with a minimum of manual intervention. The system features a 4-axis, CNC-controlled table mounted grinding and polishing unit, precision-engineered drive components, and feed-through lapping and polishing trays to achieve optimal finish quality. Its rugged design makes it suitable for processing hard-to-grind materials. 22BFS-4M offers high-precision grinding and polishing operations with automatic edge detection capabilities to maintain consistent grinding tool contact for wafers up to 200mm in diameter. The 4th axis allows for simultaneous processing of multiple wafers at different positions on the table top. The machine has a wide range of grinding and polishing tools available to accommodate different application requirements. It also incorporates a closed-loop feedback tool to ensure precise control of the grinding/polishing pressure to achieve the desired lapping rates and finish. The asset also includes auxiliary modules such as a vibration dampening model to limit operator fatigue and in-process monitoring systems to measure grinding pressure and profile. This ensures that the output conforms to the desired metrics. HAMAI 22BFS-4M also has a number of process maintenance features built into the equipment, allowing it to perform maintenance routine and replace consuming components without manual intervention. The easy-to-use control panel simplifies user operation and maintenance. Overall, 22BFS-4M is an advanced grinding, lapping and polishing system designed to provide superior grain size consistency and smoother wafer surfaces with minimal effort. Its advanced features and robust design make it suitable for a wide variety of industrial wafer processing applications.