Used HAMAI 22BN3M5P #9168275 for sale

HAMAI 22BN3M5P is a fully automated wafer grinding, lapping and polishing equipment. The system is designed to process both silicon and other materials with equal simplicity and effectiveness, making it ideal for high volume production. It features a six-axis robot, multiple CNC machining centers, as well as the latest in proprietary polishing heads. The robot itself is built on either the ABB or Yaskawa robotic platform for mechanical accuracy and reliability. Its unique integrated head design means no part handling is necessary, making the grinding process faster, smoother, and much more efficient. The integrated "head-on-head" design also helps to reduce CTE mismatch, further improving efficiency. Moving on to the machining centers, these are constructed with the latest in micro-milling and grinding technology. The milling heads feature up to 4 cutting tools and the grinding wheels have a diameter range of 0.3mm up to 3mm. This range of cutting tools and grinding wheels allow for greater versatility and the ability to achieve superior surface finishes. The polishing head is the latest and greatest in proprietary technology. It features advanced servo control and the most advanced abrasives for precision grinding and polishing. The laser-guided head automatically optimizes polishing results and ensures a consistent high-quality finish. Overall, 22BN3M5P is a highly efficient, cost-effective and reliable wafer grinding, lapping and polishing unit. With its powerful robotic platform and comprehensive range of cutting tools and grinding wheels, this machine is built to handle all types of materials with ease and accuracy. Thanks to its state-of-the-art polishing heads, you can be sure that the finished product will be of the highest quality available. All these features make HAMAI 22BN3M5P the perfect choice for any wafer grinding, lapping and polishing needs.