Used HAMAI 24B #293657241 for sale

HAMAI 24B is a wafer grinding, lapping and polishing (GLP) equipment designed to meet the needs of cutting edge semiconductor device manufacturers worldwide. This system is equipped with a unique, integrated design which includes a 24" horizontal axis wheel, allowing for grinding, lapping and polishing processes to be completed in shorter times with higher accuracy. 24B's integrated design incorporates a unit of integrated feature sets and capabilities, including spindle motors with a high-speed capability; an automatic CNC control machine; manual, semi-automatic, and full-automation operation and process control; and high-accuracy, feedback-induced, adaptive control of all wheel and material parameters. Additionally, a high-resolution imaging tool with a variable aperture allows users to make available a variety of process conditions. HAMAI 24B has been designed with efficiency and operator safety in mind. Its interior has been ergonomically designed, with operator access to samples from the center of the wheel, and room to accommodate up to three wheels and associated trays. Uniquely, its powerful spindle motors ensure extremely low vibration levels and an exceptionally quiet operating environment. Overall, 24B's integrated design, high efficiency and operator safety make it the ideal choice for cost-effective GLP production. In addition to its automated CNC and adaptive controls, it also has a series of parameter-adjustable process modes, allowing users to customize each of the three GLP stages. Furthermore, precision process control is enabled via both a manual and remote asset. HAMAI 24B also has a built-in data logging model, allowing it to document every sample processed. In closing, 24B is a high-end wafer grinding, lapping and polishing equipment designed to meet the requirements of semiconductor device manufacturers. Its integrated design, advanced technology and intuitive user interface make it the optimal solution for convenient, high efficiency GLP production.