Used HAMAI 24BF-4 #9273210 for sale

HAMAI 24BF-4 is a multi-functional wafer grinding, lapping and polishing machine designed for the fabrication of semiconductor devices. It is made up of a grinding unit, lapping/polishing unit, and a polishing unit. The grinding unit provides uniform grinding of semiconductor wafers by using diamond wheels. The diamond wheels are adjustable to control the grinding to respectively yield a micro-fined surface ground surface. The grinding unit also features a clamp mechanism designed to allow for a fast and reliable chip extraction. The lapping/polishing unit is designed to achieve the desired surface quality using 8-15µm diamond paste. It is equipped with an oscillator which carries out grinding and lapping motions in a round pattern. This unit also features a cleaning system which uses filtered water to prevent contamination. The polishing unit is specifically designed for chemical mechanical wafer polishing. This unit can process wafers up to 8 inches in diameter with a single substrate holder. The unit can spin at up to 5,000 rpm and contains a polishing pad and re-circulating water system. This system is designed for optimal surface condition in minimal time. 24BF-4 is designed for a variety of wafer grinding, lapping and polishing applications in the semiconductor industry. The machine is equipped with advanced safety features and a high level of automation. This enables users to achieve higher productivity levels with increased precision and repeatability. It is an ideal machine for any wafer processing application and is robust and reliable.