Used HAMAI 24BF #293651032 for sale

HAMAI 24BF is a cutting-edge wafer grinding, lapping and polishing equipment designed to produce the highest quality thin film substrates, optoelectronic and semiconductor devices. The system features a high performance in-line grinding process that enables high efficiency from start to finish. At the heart of 24BF is its micro grinding unit. With high-powered grinding spindles, it uses various diamond-tipped grinding and lapping wheels to significantly reduce the time and effort of wafer grinding for devices with intricate geometries. The grinding spindles can be configured for an abrasive map or nanofeed control for delicate devices and thin surfaces. HAMAI 24BF also features an advanced polishing machine that produces superior yields with mirror-polished surfaces. This highly efficient process uses fixed and mobile abrasive pads to optimally polish the material into the desired shape. The machine can be teamed with automated computer vision to verify the quality of the finished surface. 24BF is also designed for maximum efficiency, with a state-of-the-art robotic machine arm that can be used to load and unload the machine. The robot is integrated with a two-axis programmable microphone that can perform a variety of functions, including wavefront metrology, quality inspection, and measurements. All of these features make HAMAI 24BF an ideal choice for fast and efficient wafer grinding, lapping and polishing. The tool is specifically designed for precision substrate thinning, as well as other applications with tight quality requirements. With its cutting-edge technology and efficient processes, 24BF is sure to meet the demands of any large-scale production environment.