Used HAMAI 24BFS-P #293636553 for sale

HAMAI 24BFS-P is a comprehensive full-scale wafer grinding, lapping and polishing equipment designed for use in the fabrication of integrated circuits and semiconductor devices. It features a robust construction, including frame plate, bed plate, and a choice of processing parameters to ensure a consistent, high-quality finish to each wafer. The main components of the system are the grinding/lapping unit, motor, motor-driven slide adjuster, grinding wheel, and lapping plate. A variety of diamond, silicon grinding wheels and lapping plates are available to cater to different materials and processes. The adjustable speed of the motor with 10:1 reduction ratio and 5 power levels enables precise control of the grinding process. The grinding/lapping unit is also equipped with a vacuum chuck to securely hold the wafer during processing. The adjustable slide adjuster allows the wafer to be placed into the holder and positioned exactly on the grinding wheel or lapping plate. The maximum grinding diameter is 24", with a minimum grinding thickness of 6" and adjustable cleaning brush for a thorough and professional job. The unit also features a PPS powder separator to eliminate any residual dust, and an automated waste particle collection unit for a clean working environment. 24BFS-P is operated by a centralized computer machine, allowing the user to preset grinding, polishing, and lapping cycles as well as monitor status and safety functions. The tool also comes with a stock of pre-defined grinding parameters for easy setup and operation. Additionally, the asset has a user-friendly graphical user interface (GUI) for simple and intuitive operation. HAMAI 24BFS-P is an efficient and reliable model that has a proven track record in the world of semiconductor fabrication. It is feature-rich, highly efficient and offers an industry-leading quality assurance equipment, allowing users to achieve an incredibly high degree of accuracy and consistency with their wafers.