Used HAMAI 24BN-P #9273137 for sale

HAMAI 24BN-P is a wafer grinding, lapping and polishing equipment specifically designed for silicon or other semiconductors used in the production of integrated circuits. This system provides a high precision machining capability, typically at submicron level accuracy, on substrates at varying sizes and shapes. HAMAI 24 BN P unit utilizes a high-precision, diamond lapping wheel and diamond slurry to effectively grind, lap and polish the wafer surfaces. It is ideal for both single and double side wafer processing, making it well-suited for a variety of different industries. The wafer is placed in the machine, which then utilizes high precision and speed to drive a dovetail-shaped diamond wheel to perfectly grind, lap and polish the surface of the wafer. The machine is controlled by a digital signal processor, allowing for precise settings such as speed and pressure. Additionally, the tool is integrated with a feedback loop algorithm that constantly monitors and adjusts the settings in order to optimize the wafer surface treatment. The lapping processes are also automated, allowing for low pressure settings which produce a high quality finish with minimal surface damage. Should further polishing be required, the asset is equipped with a separate rotating diamond wheel and abrasive slurry designed to maximize the micro-polishing power. 24BN-P is capable of working with a wide range of wafer sizes and shapes including circular, rectangular, square, hexagonal and octagonal formats. Once the wafer has been treated, a photomicrograph inspection module is also included to analyze the finished surface of the wafer. Overall, 24 BN P is a reliable and precise wafer grinding, lapping and polishing model that achieves excellent results and is suitable for fabricating integrated circuits and other semiconductor components. This equipment is capable of efficiently and accurately carrying out a high precision machining process at submicron levels.