Used HAMAI 24BN-P #9355605 for sale

HAMAI 24BN-P Wafer Grinding, Lapping & Polishing Equipment is specifically designed to meet the most exacting requirements of semiconductor device manufacturers. The system offers a wide range of working sizes (up to 7") and wide range of grinding and polishing speeds, enabling high-end wafer processing with superior surface finish quality. It boasts of a built-in 5-axis control unit and a high-precision air bearing to achieve extremely precise control during various operations such as grinding, lapping and polishing. HAMAI 24 BN P Machine is equipped with a powerful DC motor drive unit capable of producing a wide range of grinding speeds so that different edges and surface flatness can be achieved. The speed control is done via a SPI interface, and speeds up to 6,000 rpm can be achieved. The tool also features a proprietary high-precision air bearing spindle asset which enables high-precision and torsionally rigid grinding of wafer edges. Furthermore, 24BN-P Model utilizes a wide range of lapping and polishing consumables. The consumables are available in both liquid and paste forms, and can be tailored to specific requirements. The equipment also features an adjustable work carriage and various tilt drives for easy adjustment and application of the desired grinding/polishing pressure. A robust 5-axis control system ensures precise control of the wafer grinding and polishing operations. The unit is suitable for a wide variety of substrates, including silicon and sapphire substrates. It is also compatible with various lithographic processes, imaging systems, and almost any type of chemical-mechanical polishing systems. All of these features are integrated into a high quality, compact and user-friendly machine package. Overall, 24 BN P Wafer Grinding, Lapping & Polishing Tool is the perfect solution for high-end wafer processing in semiconductor device production.