Used HAMAI 3BN-3M8L #9225441 for sale

HAMAI 3BN-3M8L is a wafer grinding, lapping, and polishing equipment designed to produce high precision geometric and topographic surfaces on semiconductor materials, such as silicon wafers and optical substrates. This system provides a complete solution for all processing needs from sample preparation to the final polishing stages. 3BN-3M8L's grinding process uses special designed abrasive products for wafer grinding to ensure minimal surface damage. The unit utilizes a precision-balanced motor machine and a high-channel depth grinding plate to achieve a uniform grind over the entire surface of the wafer. This process is recirculatory, allowing for repeatable and consistent surface results in a single pass at a constant spindle speed. Once the wafer is to the desired size, its surface is lapped to remove small scratches and fine particles and thus prepare the wafer for the polishing process. The advanced lapping process on HAMAI 3BN-3M8L offers high accuracy surface uniformity and superior repeatability with its two-direction rotating design. Its manually adjustable slurriness adjustment allows to accurately set the lapping pressure with minimal waste and ideal lapping effect. Finally, the wafer is polished to the desired condition with the polishing function on 3BN-3M8L. This tool utilizes a special polishing solution for polishing of the substrate, which is then supplied with an adjustable pressure. This ensures a consistent finish with minimal local abrasive buildup. In addition to these processes, HAMAI 3BN-3M8L offers a unique inspection asset to ensure top results. The optional on-board particle analysis model allows to perform an image particle analysis which can be used to identify and filter out particles from the finished product. In addition, the equipment can also be used to measure the surface roughness of the wafer to ensure the highest level of accuracy and precision. 3BN-3M8L provides an industry-leading wafer grinding, lapping, polishing, and inspection solution specifically designed to yield optimal results in single-pass processing. It is perfect for high-end semiconductor-grade wafer processing and fabrication applications.