Used HAMAI 3BN-3M8L #9257677 for sale

HAMAI 3BN-3M8L is an advanced, fully automatic wafer grinding, lapping & polishing equipment designed to deliver superior performance in a number of different wafer production applications. This system is equipped with several sophisticated technologies, including an in-process measurement unit and precision touch panel monitor control. Additionally, it is capable of accommodating a variety of wafer sizes, ranging from 8" to 12" with a maximum surface finish of 0.25µm Ra. The machine's cutting-edge technologies offer exceptional accuracy and repeatability, significantly reducing the risk of human error. Its high-performance grinding and lapping capabilities provide the capacity to achieve high-level surface finish accuracy and uniformity. Moreover, they enable fast and efficient wafer production that is consistently reliable. 3BN-3M8L is an easy-to-use machine with a user-friendly interface. It features an intuitive graphical operator interface that supports powerful, on-screen instruction and monitoring capabilities. Particularly noteworthy is its versatile software upgrade feature, which allows for better optimization of process parameters and improved surface finish results. The tool incorporates an automatic wafer grinding and polishing asset, making this model suitable for production of both single- and double-side processed wafers. The efficient process control equipment prevents fluctuations in wafer thickness and grinding results within a tolerance of ±0.001mm. This ensures that the entire grinding and polishing process stays stable and that each wafer is delivered with a consistent surface quality, ready for further processing. HAMAI 3BN-3M8L also employs a state-of-the-art, in-process measurement system to track the entire grinding and polishing process with exceptional accuracy. Its high-resolution digital video microscope enables real-time, in-process wafer surface measurement, allowing the unit to constantly guarantee wafer uniformity and precise surface finish. Furthermore, the machine offers reliable dicing capabilities, which is critical for production of high quality, single and double sided wafers. The dicing saw has a high speed spindle and droplet-proof nozzle to ensure precise dicing with minimal break-outs. In short, 3BN-3M8L is a versatile and powerful wafer grinding, lapping & polishing tool that produces superior results. With its advanced technologies, intuitive operation and superior performance, the asset is an ideal choice for both single- and double-sided wafer production.