Used HAMAI 3BN-3M8P #9225442 for sale

HAMAI 3BN-3M8P is a precision equipment used for wafer grinding, lapping and polishing. It has a high degree of accuracy with speeds that can reach over 9,000 RPM. The system features a table mounted diamond grinding wheel and two lapping plates, as well as a polishing head and floating head, making it capable of multi-tasking grinding and polishing jobs. The unit also features a vacuum machine and thin diamond films for surfaces. The vacuum tool reduces dust and improves the uniformity of the surface, thus improving the high precision of the processing. Thanks to the thin diamond films, the asset can grind and lap with greater speed, resulting in greater productivity. The model has a CNC control, allowing one to control the grinding wheel, lapping plates and polishing head individually and creating a customised process. It also has an automatic offset correction capability, which allows it to quickly and accurately adjust the position of thecutting tool for various materials and different layers of grinding, lapping and polishing. The equipment benefits from a high degree of flexibility, allowing it to handle a wide variety of jobs, including single-side, double-side, flat and curved surfaces. This makes it suitable for a variety of semiconductor and wafer grinding, lapping and polishing tasks. In addition, it features a programmable joystick, which allows for manual autonomous control. This is useful for checking and controlling the quality of the surface, ensuring that it is perfectly polished. 3BN-3M8P is a high-quality, precise, and reliable system for wafer grinding, lapping and polishing. It is the perfect choice for those looking for an efficient and highly productive unit for their manufacturing needs. Thanks to its advanced technology and features, it is capable of reaching precise results with the utmost reliability and quality.