Used HAMAI 4B #9276645 for sale

HAMAI 4B is a high-precision wafer grinding, lapping and polishing equipment designed for the production of flat and polished semiconductor wafers from a variety of materials such as silicon, gallium arsenide, and glass. The system is composed of a number of separate processing chambers and precision-controlled components to ensure that all surfaces of the wafers are perfect and free from defect. 4B is capable of grinding and lapping wafers up to 8 in. in diameter with a maximum thickness of 0.3 mm, with selectable pressures ranging from 1.0MPa to 0.02MPa. The precision-controlled grinders actuates two 4-axis drive stages, providing a plane overall accuracy of 0.2 microns for both the X and Y axes, while the Z axis is adjustable to 0.4 microns. After the wafers have been ground and lapped, the unit utilizes a chemical and mechanical or chemical and electro-polishing process, depending on the material being processed. During this process, the unit is capable of controlling stock removal up to 0.25 microns per hour, which allows for the production of polished surfaces with a roughness range of Ra 0.1 to 0.4 microns. HAMAI 4B also offers a wide range of automated options to streamline their process for production needs. These include automatic wafer loading and unloading, automated thickness measurements, and robotic systems for clamping and polishing. Additionally, the unit includes a machine vision unit to monitor the progress of the polishing process. In summary, 4B is an advanced wafer grinding, lapping and polishing systems providing significant control and automation capabilities. With its high precision components and integrated machine vision machine, it is capable of producing high quality polished wafers with superior surface finish and low levels of defects.