Used HAMAI 4BF #9050532 for sale

HAMAI 4BF is a wafer grinding, lapping and polishing equipment, designed for production of high-quality, precision wafers. It is capable of efficiently producing large numbers of wafers in a wide range of applications, from automotive to medical device production. 4BF system is capable of producing high-precision flat wafers with a variety of materials, including silicon, sapphire and gallium nitride. HAMAI 4BF unit utilizes the Biotool diamond grinding and polishing wheel technology to accurately grind and polish wafers. The machine is comprised of four separate grinding/polishing units, each with their own diamond grinding wheel, which are mounted on two parallel spindles. The four grinding wheels are rotated simultaneously, using a variable speed drive, which allows for precise control of the grinding speed and accuracy. The wafers are loaded into the tool at the top of the spindles and are then moved along the two spindles and abraded using the diamond grinding wheels. During grinding, the asset is able to inspect each wafer, ensuring that the desired flatness and surface roughness is achieved. After grinding, the wafers are moved to the polishing station, where the diamond wheels buff the finished surfaces to a fine polish. 4BF model is capable of producing wafers with a wide range of flatness and surface roughness, from ultra-smooth polishes to highly precise flats. It is also capable of achieving high yields of defect-free wafers, with low rejection rates. Additionally, the equipment can be used in both wet and dry applications, making it a versatile tool for the production of specialized wafers. HAMAI 4BF system is designed for consistent, high-quality production of wafers. Its variable speed drive and precise grinding and polishing wheels make it an ideal choice for a wide range of applications. The unit is also capable of producing wafers with a very high degree of accuracy, offering customers a reliable and cost-effective solution for their wafer needs.