Used HAMAI 4BF #9143472 for sale

HAMAI 4BF Wafer Grinding, Lapping & Polishing Equipment is a high-precision, multi-functional machine designed for grinding and lapping semiconductor wafers. It features a three-axis reciprocating table mechanism made of cast acrylic, which provides for precise, repeatable grinding and polishing operations. 4BF also has a patent-pending lifting platform, so the wafer can be lifted quickly and easily for separation after the procedure. The system comes equipped with a variety of grinding and polishing tools as well as a digital conditioner monitor, which displays the progress of the operation in high visibility. Furthermore, users can control and monitor the grinding and polishing process easily through its integrated software. HAMAI 4BF offers high-precision and automated operation, with repeatable results. Its component design is particularly suitable for preserving the physical quality of the wafers, as it reduces mechanical stress on the structure, preventing wafer breakage. In addition, the unit has a robust, 45 mm deep side-rail guide that helps to reduce overall cycle times and improve the efficiency of the grinding and polishing operation. It also ensures that each piece is processed with uniform consistency, while minimizing deviation in the finished product. Finally, 4BF has an exchangeable drive machine, meaning that it can be adapted to accommodate various materials and grinding/polishing sizes. Overall, HAMAI 4BF Wafer Grinding, Lapping & Polishing Tool is an advanced, multi-functional asset that delivers reliable, precise, and repeatable results in a high-volumne wafer processing environment. It is an ideal choice for semiconductor wafer manufacturers that specialize in high-accuracy applications and require fast and efficient operations.