Used HAMAI 4BF #9208869 for sale

HAMAI 4BF Wafer Grinding, Lapping, and Polishing equipment is designed for high-quality, high‑volume material conditioning of semiconductor wafers. It is capable of grinding, lapping, and polishing wafers up to 4" diameter. It is adaptable to a variety of applications, from semi-conductor wafer production to the fabrication of optical components. The system consists of four major components: a grinding wheel, a lapping wheel, a polishing wheel, and a polishing cloth. The grinding wheel is composed of diamond abrasive particles which are held together by a layer of metal such as nickel. The grinding wheel is used to roughen the surface of the semiconductor wafer and to remove any contamination from the surface of the wafer. The lapping wheel is composed of silicon carbide abrasive particles which are held together by a layer of metal such as nickel. The lapping wheel is used to smooth and level the wafer surface and reduce the surface roughness to a desired level. The polishing wheel is composed of a polishing agent such as cerium oxide and a backing material, such as nylon. The polishing wheel is used to further smooth and polish the wafer surface to achieve a highly reflective finish. The polishing cloth is composed of a ultra-fine cloth material. The polishing cloth is used to clean and protect the polished wafer surface. The unit is designed for easy installation, maintenance, and calibration. It has several adjustable parameters, such as grinding speed, grinding pressure, lapping force, polishing speed, and polishing pressure. This flexibility allows for high levels of customization, enabling the user to create high-quality materials for a variety of applications. The machine also features an integrated graphical user interface (GUI) with a high-resolution monitor. The GUI allows for easy operation and monitoring of the entire process. 4BF Wafer Grinding, Lapping, and Polishing tool is an important tool for high-volume production of semiconductor wafers. It is capable of producing high-quality results and can also be used to fabricate optical components for a variety of industries. Its flexibility, ease of operation, and integrated GUI make it an ideal choice for high-volume production.