Used HAMAI 6BF-10P-2M #9208865 for sale

HAMAI 6BF-10P-2M is a wafer grinding, lapping and polishing equipment used to produce consumer grade semiconductor wafers. This system utilizes an abrasion step to grind and lap the wafer before undergoing the polishing step. The first step in the process is the grinding step. In this process, rotating grinding discs with diamond abrasive are employed to grind the wafers down on both sides. The grinding process enables the wafer configuration to reach a specific flatness, as well as having minimal scratches and distortion. This process produces high removal per pass. Next in the process is the lapping step. This step further polishes the wafers into the desired configuration. In this step, rotating lapping plates containing diamond abrasive material are used. This allows for the wafers to have even lower defects and attain precise uniformity with minimal stress. Finally, the polishing step is completed. Using a rotating polishing wheel, the wafers are further smoothed and polished. The degree of polish produced by this step depends on the process material used. Once the desired results are achieved, the wafers are then processed further for inspection and characterization. 6BF-10P-2M unit features a large table for mounting the wafers. This table allows for rapid transfer of the wafers from one process to the next. The entire unit is computer-controlled, allowing for the grinding, lapping, and polishing steps to be optimized to produce the best results possible. HAMAI 6BF-10P-2M is designed to safely and accurately produce quality wafers with minimal defects. Its user-friendly interface makes the machine ideal for production to consumer grade semiconductor wafers, allowing for higher yields and improved efficiency. With its broad range of features, it can meet the most demanding semiconductor requirements.