Used HAMAI 6BN-3M5L #9398250 for sale

HAMAI 6BN-3M5L is a precision wafer grinding, lapping and polishing equipment that provides superior results for a wide range of semiconductor components and applications. Its modular construction and advanced technological solutions provide customers with a fast, accurate and automated solution for their wafer processing needs. 6BN-3M5L allows for superior fine surface finish on a variety of materials. It is a highly efficient system that can grind, lap, and polish wafers to the highest precision. The machine includes a grinding station, a polishing plate station, and a metrology station. The grinding station features an adjustable motor speed, feed rate, work-holding fixture and operation speed. This revolutionary design gives maximum control to the operator for precision grinding of semiconductor wafers. The polishing plate station has a large turntable with a fully automated and programmable polishing process. There are a number of preset programs available with customizable ones also available. The polishing plate is constructed with a double-action spindle and large particle filter allowing for maximum accuracy and repeatability. The metrology station includes a series of high-precision metrology measurements, including surface roughness, flatness and profile measurements. The unit features an integrated laser interferometer which provides accurate results. This helps to ensure process quality and integrity. HAMAI 6BN-3M5L is an intelligent, automated and easy-to-use machine that provides superior grinding, lapping and polishing results. It is capable of reproducing high-precision wafer-related products with minimal setup time. This machine is ideal for semiconductor engineers, technicians and production personnel.