Used HAMAI 9B-5L/P #9073245 for sale

HAMAI 9B-5L/P is a versatile wafer grinding, lapping and polishing equipment that is used by semiconductor manufacturers around the world. This system allows for high quality processing of various types of materials, from ultra-fine polishing down to large lapping operations. HAMAI 9B-5L/P has a processing area of 500 millimeters that allows for the grinding, lapping and polishing of semiconductor wafers up to 8 inches in diameter. It is equipped with a wafer bed and a double-head drive unit that allows for the simultaneous grinding and lapping of wafers. The machine is also equipped with a variable speed mechanism and a contact pressure regulator that ensures the desired contact pressure between the wafer and the grinding or lapping disk. The tool is automated with an advanced feedback control asset that ensures that the grinding, lapping and polishing steps are performed accurately and consistently. The control model also monitors the speed and pressure of the grinding, lapping and polishing disks as well as the temperature of the equipment. Additionally, a variety of sensors and monitoring devices are used to ensure that all grinding, lapping and polishing operations are performed correctly. HAMAI 9B-5L/P utilizes a slurry bath and is capable of efficient removal of particles from the wafer surface. The slurry bath allows for the grinding, lapping and polishing of wafers at a very high rate of speed and accuracy. The system is equipped with a vacuum unit that removes the slurry from the wafer after processing. HAMAI 9B-5L/P is a highly efficient wafer grinding, lapping and polishing machine designed to provide the highest quality processing of various types of wafers. This tool can be used to efficiently produce high-precision parts, providing the best possible results. It is a versatile solution, designed to meet the needs of many different semiconductor processes.