Used HAMAI 9B-5L #9276646 for sale

HAMAI 9B-5L is a multipurpose wafer grinding, lapping, and polishing equipment designed to meet the requirements of a range of different applications. This system is especially useful for research, development, and industry applications. This unit has a working area of 600 mm x 600 mm and a weight of under 650 Kg, making it ideal for applications where space and cost are of the highest importance. The machine is equipped with an advanced microprocessor-controlled automation tool that can be programmed for a variety of grinding, lapping, and polishing operations. The asset is equipped with a modular lapping and polishing unit which can handle wafer size up to 9" (228.6 mm). The unit is equipped with abrasive feed rate control and can grind from 15 micron to 500 mm. The unit can also be used to calculate an accurate, high precision and uniform planarization of both flat and curved surfaces. 9B-5L also features a dual disc grinding unit, equipped with high speed spindle motors. Both the left and right discs can be independently loaded and adjusted for proper grinding. This allows for efficient grinding and uniform planarization of materials over a larger surface area. Finally, the model is equipped with an optional vacuum deburring chuck. This allows for quick and easy post-lapping cleanup, offering a superior finishing touch to the polished surface. Overall HAMAI 9B-5L is an excellent choice for those looking to invest in a reliable and cost-effective solution for all their wafer grinding, lapping, and polishing needs. With its advanced features and performance, the equipment is capable of providing quick, and high-quality results while increase cost efficiency. Its design is unsurpassed, making it a must-have tool for all the industries requiring accurate flat and curved surfaces.