Used HAMAI 9B #9208867 for sale

HAMAI 9B is a wafer grinding, lapping and polishing equipment used to process wafers in semiconductor production. The system is used to achieve optimal etched surfaces with no harm to the metallization or electrical properties of the wafer. 9B is able to effectively grind and polish wafers of different sizes, shapes, and thicknesses with minimal waste, allowing for increased accuracy and precision in part production. HAMAI 9B unit is designed for fully automated process control and offers complete machine integration for efficient and accurate operation. It features a robust grinding, lapping and polishing line, which enables a high level of accuracy and repeatability in the polishing process. The process steps are controlled by a powerful FCS-3000 multi-step controller and designed with a user-friendly, intuitive HMI interface. 9B is a single-wafer processing tool and supports wafer sizes from 2" to 6". It features a high speed main spindle and cross-feed head, allowing for precise and accurate grinding, lapping and polishing processes. The asset also includes an integrated polishing station and an optional cooling/rinsing station. It is also equipped with vacuum filters and a grinder air cleaning model to maximize process safety. HAMAI 9B is capable of grinding, lapping and polishing various metals and ceramic substrates. It is capable of producing etched surfaces with high optical reflection, allowing for optimal bonding with other parts in production. It is also capable of producing highly accurate, steep sidewall angles to create fine, detailed parts. Its 6-axis robotic arm offers precise part positioning, controlling the wafer with machine operation. The equipment also features stainless steel vacuum cassettes for easy wafer handling, and a waste disposal system for environmental safety. It is also designed with a dust extraction unit to minimize airborne particles and dust particles, for a clean and safe working environment. 9B is an efficient and precise solution for your wafer grinding, lapping and polishing needs.