Used HAMAI 9B #9237367 for sale

HAMAI 9B is a fully automated wafer grinding, lapping and polishing equipment for large scale semiconductor production. This system utilizes advanced, proprietary grinding, lapping and polishing technology to achieve accurate high-quality finishes on semiconductor wafers. This unit is able to achieve the repeatable uniformity, flatness and smoothness required for efficient semiconductor production. 9B machine is designed to reduce production costs by decreasing chip burn-in rates and reducing product quality defects. This tool utilizes a unique, patent-pending lapping and polishing process to ensure high-yield productivity and consistent product quality. This asset utilizes several state-of-the-art advances such as an oscillating wafer carrier, an omni-directional wafer transport mechanism, and a three-stage polishing process to achieve highly uniform, consistent finishes on the semiconductor wafer. This model also employs a unique, dual-stage grinding equipment that allows for both vertical and horizontal grinding of semiconductor wafers. The vertical grinding process allows for superior removal of both bonding layers and top silicon layer. The horizontal grinding process allows for a uniform grinding of the silicon surface to provide an ideal surface for wafer mounting. HAMAI 9B system utilizes an integrated wafer cleaning station to ensure a clean, defect-free start to the grinding and polishing process. This unit features an automated cleaning process that recirculates the abrasive slurry that is used to grind and polish semiconductor wafers. This ensures a consistent, controllable quality that eliminates the variability found with manual cleaning processes. 9B also features a sophisticated, integrated data acquisition and control machine that provides precise performance control and data acquisition. This tool provides accurate, statistical process control of the wafer lapping and polishing process. This asset also has a unique fault detection and alarm model which will isolate potential failures and report detailed fault data to the operator. HAMAI 9B equipment is designed with the highest safety standards in mind. This system utilizes a redundant fail-safe unit to ensure the safety of the operator. The machine includes several interlock mechanisms that are designed to protect the operator from high temperature and excessive pressure sources. In conclusion, 9B is an ideal wafer grinding, lapping and polishing tool for large scale semiconductor production. It allows for repeatable product quality, reduced chip burn-in rates and an efficient production process that will help to maximize yield and minimize defects. This asset is also designed to ensure the highest safety standards are met and provide precise performance control and data acquisition.