Used HAMAI 9BF-2M #9119005 for sale

HAMAI 9BF-2M is a wafer grinding, lapping and polishing equipment for high speed, high precision applications. The system is capable of performing multi-axis operations with near perfect accuracy, running both wet and dry applications. It is composed of a stationary base, a drive unit, a spindle, and a tool holder. The drive unit consists of two servomotors and a ball screw assembly which drives the spindle. The servomotors are connected to an adjustable speed control unit which allows the user to adjust the speed, torque and motion profile of the unit. The machine is fitted with a locking mechanism, allowing it to securely clamp large wafers with a wide range of thicknesses. The spindle is connected to the drive unit via a belt and a hydraulic clutch which permits accurate grinding, lapping and polishing of the wafer. The tool is computer controlled, with a user-friendly Interface featuring uptime monitoring, material-specific parameters and user profiles. The interface also supports process automation, allowing the user to set the asset to run at predetermined speeds, accelerations, angles and positions. The spindle is fitted with diamond grinding, lapping and polishing tools, controlled by pneumatic or electrical switches. Depending on the material of the wafer, the user can select the appropriate tools for the operation. The model is capable of precise and uniform results on a variety of wafer materials including glass, ceramics, silicon and even hard metals. The equipment is designed to be compact and is suitable for benchtop operations, with the drive unit mounted on the base. It is also possible to securely fix the system to the floor for robust grinding, lapping and polishing operations. 9BF-2M wafer grinding, lapping and polishing unit is a reliable and efficient machine designed for a wide range of materials and operations. The wide range of process parameters and the user-friendly interface make it an ideal choice for high precision operations. The tool's flexible design allows it to adapt to various applications, making it the perfect choice for high accuracy grinding, lapping and polishing of wafers.