Used HAMAI 9BF #9166352 for sale

HAMAI 9BF Wafer Grinding, Lapping and Polishing Equipment is a fully automated machine designed to achieve high levels of surface finish and flatness in the processing of wafers. It is suitable for manufacturing and industrial applications, enabling the restoration of wafers to their original specifications. 9BF system can handle wafers up to 9 inches in diameter and is capable of grinding, lapping, and polishing at temperatures up to 300°C. It is equipped with a double-stage vacuum pump, an integrated lapping unit, and a removable polishing spindle for multiple applications. The machine has a robust construction that ensures high accuracy and stability during the wafer grinding and polishing process. HAMAI 9BF tool utilizes a closed-loop control asset and a fully programmable PLC controller. This allows users to pre-program processing cycles for specific materials and wafer sizes, with one program suitable for all wafer sizes. The motor speed, spindle radius, and polish time can be adjusted by the user to achieve a desired surface finish and flatness. HAMAI model provides a high level of repeatability and accuracy in the wafer grinding and polishing process. It is designed for high throughput and productivity, with short cycle times and small particle sizes. It can be used to process hard materials such as aluminum nitride, DLC, and silica dioxide. HAMAI equipment includes a variety of diamond lapping plates and abrasive materials, along with a variety of other accessories to enable increased productivity and flexibility. 9BF system is CE certified and UL Certified, meeting all safety, health, and environmental standards. It is designed for use in cleanroom environments and can be integrated into existing manufacturing systems. Due to its reliable performance and quality, HAMAI 9BF unit is widely used in wafer processing applications.